PACE to Host SMTA Capital Chapter Presentation on “Non-Destructive BGA/Area Array Component Rework”

Terms and Definitions

Process Guides that cover specific component applications for assembly, rework and repair. These are searchable by installation/removal, component type, and handpiece or system used.

Feb 15, 2019

 

PACE Worldwide is proud to host the upcoming SMTA Capital Chapter's presentation and live demonstration on “Non-Destructive BGA/Area Array Component Rework” on Tuesday, February 19th at PACE's Elkridge Engineering and Training Center in Elkridge MD:

Date:
February 19, 2019 @ 5:30pm

Location:
PACE Worldwide
PACENTER Training Facility
6605 Selnick Drive #C
Elkridge, MD 21075

Agenda:
5:30 – 6:15: Registration/Dinner
6:15 – 7:15: Presentation
7:15 – 7:45: Demonstration

“Non-Destructive BGA/Area Array Component Rework.”

Abstract:
In the past 20 years, such mundane operations as soldering, desoldering and component replacement have become complicated by extreme micro-miniaturization, the use of lead-free solders, new thermally challenging pc boards, heat-sinking bottom terminated components and intricate component packages that are difficult to rework or install. One area that presents unique challenges is BGA/Area Array rework. Modern boards that use these components are more technically demanding than ever, requiring skilled operators who are highly competent at accomplishing delicate, intricate soldering and rework tasks. Unfortunately, many operators will cause more damage to the assembly or components due to his/her rework actions. As a result, many manufacturers struggle to repair or rework boards, opting to throw away lower value boards or hire outside contractors to perform the more difficult repairs. This presentation will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of BGA rework using available convective and infrared heating techniques. The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework.
 
About the Speaker:
Aaron Caplan is the Director of Marketing & Training for PACE Worldwide, a company solely focused on providing innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for well over 50 years. Mr. Caplan has been involved in electronics manufacturing technology since the 80's and is an acknowledged expert in Miniature/Microminiature Electronics Repair. A CIT in IPC-7711/IPC 7721, he provides technical expertise in teaching of non-destructive PCB rework/repair techniques, educating industry on how to properly utilize these techniques. In addition to his marketing duties, Mr. Caplan also coordinates the Training Department and Video Production Team, providing direction for a wide variety of video production projects.

For additional information, click here:
http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=14

To RSVP, please click here:
http://www.smta.org/chapters/rsvp.cfm?BEE_ID=4622&BULK_EMAIL_NO=6