TT-65 ThermoTweez Thermal Tweezer (SensaTemp)
Terms and Definitions
Process Guides that cover specific component applications for assembly, rework and repair. These are searchable by installation/removal, component type, and handpiece or system used.
Process guides covering basic knowledge such as tip selection, tip preparation, land preparation, etc.
Addresses critical maintenance and troubleshooting steps to keep you and your equipment working at top performance and efficiency.
The ONLY Thermal Tweezer with 4-Sided Component Removal Capability
The TT-65 ThermoTweez provides safe, one-handed reflow and removal of 2-sided chip components, SIT's, SOIC's, SOJ's and is the only Thermal Tweezer that can handle large PLCC's, QFP's and other four sided components. Unlike other methods, its high thermal capacity and targeted heat removes large SMDs in just seconds without damage to the board of the risk of adjacent components reflow even on heavy assemblies. The unique vertically orientated handpiece and a wide variety of quick-change, slim-line tips easily reach into the tightest spaces for fast, safe component removal. The TT-65 also features a patented “stroke” adjustment to reduce hand fatigue for repetitive operations. IntelliHeat and SensaTemp versions available. Tips supplied separately.